Double Side Copper Core PCB

Product introduction:

Double Side Copper Core PCB

Patent process of copper substrate:

Double Side Copper Core PCB is produced according to this patented process, so the appearance is particularly exquisite.

1) In the normal process, high-temperature resistant adhesive is affixed to the position of copper substrate to be surface treated, which requires manual gluing by workers and it is flat without bubbles, which consumes a lot of labor; Through our improvement, we can print UV ink at this position, and protect this position after UV lamp irradiation and curing, so as to avoid the phenomenon of leakage, deviation and uneven rubber surface when sticking high temperature adhesive.

2) High temperature resistant adhesive can not be reused after tearing, which wastes a lot of tape materials; Our UV ink printing position is accurate, easy to operate, and reduce the costs.

3) In the process of pasting high-temperature resistant glue, the high-temperature resistant glue needs to be torn off, but due to the difficulty of the tape, the residual tape will affect the subsequent surface treatment; Our UV ink layer falls off the copper substrate directly after the V-CUT is made, eliminating the tearing process and improving efficiency.

3、copper substrate surface treatment process steps:

Double Side Copper Core PCB is produced through this process, please refer to the following steps:

1) Provide pretreated copper substrate;

2) Both sides of the copper substrate to be bent are printed with UV ink, the copper substrate is placed in the UV machine with three 80W/cm high pressure pump lamps, the UV irradiation energy is adjusted to 1400mj/cm2, irradiation for 10 minutes to cure the UV ink on the surface of the copper substrate;

3) Brown the surface of the copper substrate with brown liquid at an operating temperature of 20-160℃;

4) Use the pressing machine to press the copper substrate covered with UV ink, drill the copper substrate after pressing, and the operating temperature is 20-160℃;

5) The gong is plated once after the shape of the finished product, and the operating temperature is 20-160℃;

6) Make the outer circuit of the copper substrate, and the operating temperature is 20-160℃;

7) Printing ink on copper substrate, operating temperature is 20-160℃;

8) After the shape of the finished gong is produced for the second time, V-CUT is made, and the operating temperature is 20-160℃. After V-CUT is made, the UV ink layer directly falls off the copper substrate, and the exposed copper surface is to be bent.

9) On the copper substrate to be bent surface treatment, surface treatment is one of gold, silver, gold, tin, tin plating;

10) The finished product is obtained after bending the copper substrate;

11) Inspect the appearance of finished copper substrate and pack it for storage.

4、 Company introduction:

Bente Circuit has the most advanced full set of automated high-precision production and testing equipment in the industry, to achieve self-produced one-stop service. The company continues to introduce high precision production equipment, CCD drilling precision engraving machine, online AOI wire detection, automatic coating, tunnel oven, sandblasting board, super coarse horizontal line, thermoelectric separation vacuum press, LED automatic exposure machine, automatic adding system vacuum etching horizontal line, computer machine, automatic text printer, laser cutting machine, automatic hydraulic unmanned punch, On-line high pressure testing machine, to achieve efficient and automated production process.

5、Relevant certifications of our company

It has obtained ISO9001:2015(certification No.: 06922Q17993R1) quality management system certification, SGS certification, American and European UL certification (UL No.: E507367)

Bente Vision:

To become a characteristic leader in the circuit board industry.

http://www.novapcb.com/